Noelle Industries, Encapsulants

Noelle Industries, Inc. manufactures customized Encapsultans. These are some of Noelle’s most popular encapsulating materials. We can develop an application specific encapsulant to suit your needs. Click on a product number to see Data Sheet for viewing and printing. You will need Adobe Acrobat Reader in order to view the Data Sheets.

804 – 86 A two component, room temperature cured, alumina filled, flame retardant epoxy encapsulant and potting compound.

805 – 53 A one component, heat cured, slightly thixotropic, 100% solids, liquid epoxy encapsulant and insulating compound.

805 – 86-2 A two component, convenient 1:1 mix ratio epoxy encapsulant and insulating compound featuring low exotherm during cure.

805-98 A one component, ivory colored, B-stage epoxy, high temperature properties for lid sealing and die bonding.

805 – 99 A one component, light brown colored, B-stage epoxy, fast cure, high temperature properties for lid sealing and die bonding.

806 – 62 A two component, high performance, room temperature curing liquid epoxy hybrid adhesive and potting compound.

807 – 30 A two component, high performance, room temperature curing epoxy insulating coating compound. This material is designed to yield moderate set up times along with a putty like consistency for ease of application.

807 – 32 A two component, alumina oxide filled, room temperature curing, liquid epoxy potting compound.

807 – 38 A two component, unfilled, heat curing, low viscosity, liquid epoxy encapsulant for filament winding and impregnation.

807 – 53 A two component, high performance, mineral filled, heat curing potting compound that features a moderate set up time.

807 – 63 A two component, unfilled, room temperature cure, water white, liquid epoxy encapsulant.

807 – 65 A two component, high performance, mineral filled, room temperature curing, potting compound that features a moderate set up time and has electrical grade insulation properties, unusually high thermal conductivity and low thermal expansion.

807 – 80 A two component, mineral filled, low viscosity, liquid epoxy encapsulant and potting compound featuring 130C operation temperature.

808 – 03 A two component, oxide filled, room temperature cure, liquid epoxy encapsulant and potting compound featuring thermal expansion.

808 – 07 A two component high performance, room temperature, oxide filled potting compound.

808 – 10 A two component, liquid epoxy encapsulant and potting compound featuring lowest thermal expansion and highest thermal K.

808 – 68-1 A two component, pourable black, high performance oxide filled epoxy encapsulant. Solvent and chemical resistant.

809 – 76 A two component, pourable, gray, room temperature curing epoxy tool compound.

809 – 100 A two component, black epoxy, low cure shrinkage and meets requirements of UL-94 VO.

810 – 11 A two component, liquid, low viscosity, clear, soft, transparent, high performance, fast curing silicone dielectric gel.

810 – 47 A two component, light weight with a specific gravity less than 0.90, liquid, very low viscosity, clear, soft, transparent, fast curing silicone dielectric encapsulant.

810 – 51 A two component, liquid, very low viscosity, clear, soft, transparent, fast curing silicone dielectric gel.

904 – 38 A two component, addition cured silicone encapsulant and insulating compound used for flexible moldings and fuser rolls.

906 – 26 A two component, pourable, unpigmented (This material available in many colors), tough, abrasion resistant, room temperature curing urethane cable splicing compound.

906 – 41 A two component, low viscosity, clear (available in black), room temperature curing, urethane encapsulant. 10 minute demold time.