Noelle Industries, Inc. manufactures customized Encapsultans. These are some of Noelle’s most popular encapsulating materials. We can develop an application specific encapsulant to suit your needs. Click on a product number to see Data Sheet for viewing and printing. You will need Adobe Acrobat Reader in order to view the Data Sheets.
804 – 86 A two component, room temperature cured, alumina filled, flame retardant epoxy encapsulant and potting compound.
805 – 53 A one component, heat cured, slightly thixotropic, 100% solids, liquid epoxy encapsulant and insulating compound.
805 – 86-2 A two component, convenient 1:1 mix ratio epoxy encapsulant and insulating compound featuring low exotherm during cure.
805-98 A one component, ivory colored, B-stage epoxy, high temperature properties for lid sealing and die bonding.
805 – 99 A one component, light brown colored, B-stage epoxy, fast cure, high temperature properties for lid sealing and die bonding.
806 – 62 A two component, high performance, room temperature curing liquid epoxy hybrid adhesive and potting compound.
807 – 30 A two component, high performance, room temperature curing epoxy insulating coating compound. This material is designed to yield moderate set up times along with a putty like consistency for ease of application.
807 – 32 A two component, alumina oxide filled, room temperature curing, liquid epoxy potting compound.
807 – 38 A two component, unfilled, heat curing, low viscosity, liquid epoxy encapsulant for filament winding and impregnation.
807 – 53 A two component, high performance, mineral filled, heat curing potting compound that features a moderate set up time.
807 – 63 A two component, unfilled, room temperature cure, water white, liquid epoxy encapsulant.
807 – 65 A two component, high performance, mineral filled, room temperature curing, potting compound that features a moderate set up time and has electrical grade insulation properties, unusually high thermal conductivity and low thermal expansion.
807 – 80 A two component, mineral filled, low viscosity, liquid epoxy encapsulant and potting compound featuring 130C operation temperature.
808 – 03 A two component, oxide filled, room temperature cure, liquid epoxy encapsulant and potting compound featuring thermal expansion.
808 – 07 A two component high performance, room temperature, oxide filled potting compound.
808 – 10 A two component, liquid epoxy encapsulant and potting compound featuring lowest thermal expansion and highest thermal K.
808 – 68-1 A two component, pourable black, high performance oxide filled epoxy encapsulant. Solvent and chemical resistant.
809 – 76 A two component, pourable, gray, room temperature curing epoxy tool compound.
809 – 100 A two component, black epoxy, low cure shrinkage and meets requirements of UL-94 VO.
810 – 11 A two component, liquid, low viscosity, clear, soft, transparent, high performance, fast curing silicone dielectric gel.
810 – 47 A two component, light weight with a specific gravity less than 0.90, liquid, very low viscosity, clear, soft, transparent, fast curing silicone dielectric encapsulant.
810 – 51 A two component, liquid, very low viscosity, clear, soft, transparent, fast curing silicone dielectric gel.
904 – 38 A two component, addition cured silicone encapsulant and insulating compound used for flexible moldings and fuser rolls.
906 – 26 A two component, pourable, unpigmented (This material available in many colors), tough, abrasion resistant, room temperature curing urethane cable splicing compound.
906 – 41 A two component, low viscosity, clear (available in black), room temperature curing, urethane encapsulant. 10 minute demold time.